Tech Brief Describes Laser Ablation as The Alternative to Chemical Etching and Solder Dams

Posted on Monday, December 04, 2017

Laser ablation is a process that product manufacturers may wish to consider when looking to remove unwanted materials from a part’s surface or when they wish to control solder flow on a PCB — typically so excess solder does not travel where it’s not supposed to and cause electrical shorting. For cleaning a surface the technology that laser ablation typically replaces is chemical milling. For controlling solder flow, the replaced technology is typically solder dams.

To learn more, download our tech brief, "Laser Ablation: The Alternative to Chemical Etching and Solder Dams."

Get our Updates

Contact Accumet today

978-692-6180

All Rights Reserved. Copyright © 1970 - 2024 by Accumet.

X
We use cookies to enhance your user experience. By continuing to browse this site, you are giving your consent for cookies to be used. For more information, please refer to our Privacy Policy.