550K Henkel/Ablestik
550K adhesive film is designed for substrate attachment and sealing microelectronic packages. This material combines high adhesion strength with good thermal conductivity in fiberglass supported film adhesive.
| Thicknesses Available | Curing | Shelf Life - Typical SL @ 50% from Noted | Thermal Conductivity |
|---|---|---|---|
| .006 | heat cured 1/2 hour @150°C | 1 Year maintained at -40°C | 121°C, W/mk = .8 |
