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One of our mottos at Accumet is to “trust the weld – with data.” By this, we mean that our design teams take every necessary step to ensure a solid, repeatable weld, that will hold up to the most rigorous of environmental conditions. We have previously explained the importance of laser welded hermetic seals and the process by which these seals are made. In our two-part blog we presented [...] Read More
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“Laser” stands for Light Amplification by Stimulated Emission of Radiation. Simply put, laser welding uses a laser's energy to generate heat in a focused beam. The beam is focused on a designated area, and energy is then pulsed through the beam and directed at that area. The beam causes the metal or metals to heat and melt at the point of the target, or “weld”. In their [...] Read More
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Lapping and Polishing are processes which are performed to achieve a desired surfaced finish, thickness, parallelism and flatness of any substrate. An application may warrant highly demanding tolerances that off-the-shelf stock or “as-fired” material simply cannot achieve. Accumet has developed several unique substrate lapping machining processes that achieve extremely tight tolerances [...] Read More
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Nobody likes being the culprit of rework. That's why design for manufacturability (DFM) is a key skill for any design engineer. But as devices get smaller and the intricate details get closer together, DFM becomes an art form. For electro-mechanical engineers looking for perfection while working with processed metals, getting tolerances dead-on perfect at the prototyping phase is essential to achieving [...] Read More
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When RF designers are weighing material choices and considering circuit design during prototype development, Accumet's material and process engineers are available to help make the right decisions about optimal tolerances and layouts for laser processing ceramic substrates. You can tap into Accumet's extensive knowledge of ceramic substrates and RF materials, circuit design, anticipated [...] Read More
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Our Capabilities Brochure, Precision Processing of Advanced Materials, describes Accumet's laser processing, lapping, polishing and supply chain service capabilities. Download yours now ››
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Our new tech brief "5 Keys to Perfecting Hermetic Seals with Laser Welding" offers DFM tips for optimizing Hermetic Seals.
Hermetic seals are used throughout the high-tech industry to provide maximum packaged protection from environmental elements that can reduce the reliability and required lifetime of critical electronics. Laser welded (or laser fusion welded) hermetic seals are the [...] Read More
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With an aging global population and a surge of innovative new healthcare related technologies, it is no surprise that the medical device and tooling industry is expanding rapidly, and competition is increasing. The latest in medical tool and device designs, such as sensors, tubes, and surgical tools and devices, are now demanding levels of precision that are forcing manufacturers to leverage new fabrication [...] Read More
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Many solid-state power electronics, including those used in high-powered LED, RF/Microwave, electric vehicle, train and rail, electrical infrastructures, and military applications rely on physically and thermally robust ceramic materials as a base. These ceramic materials are bonded to thermally and electrically conductive metals to help transfer thermal energy to heat spreaders/ heat sinks and away [...] Read More
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The latest high power radar systems require both extreme RF power density and longterm reliability, for which careful design and material choices are necessary. This Tech Brief is aimed at high power circuit and system designers, the brief details the common ceramic and semiconductor material choices encountered by designers, and offers insight on the advantages, disadvantages, and tradeoffs of each [...] Read More
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Lapping, polishing, and grinding are machining techniques that refine a substrate to exact dimensions and tolerances for optimal circuit metallization during both thick and thin film circuit technology procedures. Because the “as-fired”, or as delivered, condition of ceramic, fused silica, or titanate substrates are most often imperfect (wavy, pitted, bumpy, varied in thickness), one or [...] Read More
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Choice of ceramic materials, circuit layouts, and singulation methods are key to achieving the required cost, fabrication time, size, weight, and yield of your laserprocessed microelectronics substrates.
When it comes to shaping, drilling, and singulating circuit ceramic substrates, lasers offer key advantages compared to other methods, such as mechanical dicing (with a saw or die), water jetting, [...] Read More
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Product manufacturers may wish to consider laser marking as an alternative to screen printing (also called silk screening) when looking to permanently mark a surface such as with a bar code, a serial number, a logo, or calibration settings. Depending on the application, laser marking and screen printing each have their pluses and minuses — although for most applications laser marking is faster, [...] Read More
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Laser ablation is a process that product manufacturers may wish to consider when looking to remove unwanted materials from a part’s surface or when they wish to control solder flow on a PCB — typically so excess solder does not travel where it’s not supposed to and cause electrical shorting. For cleaning a surface the technology that laser ablation typically replaces is chemical milling. [...] Read More
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Each method has its relative pluses and minuses and no one method fits every situation. The thickness of the stock to be cut, hardness of the stock, whether or not the stock is stacked or layered, your cost and timing requirements, and the desired condition of the material after it’s been cut are among the key factors that determine which method is right for a particular job. There are also some [...] Read More
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When the object you wish to engrave has a circumference, the method of choice is typically rotary engraving, especially if you wish to engrave the object on more than one side. It is usually far easier to rotate the object on a spindle than it is to rotate the engraving equipment around the object. Most rotary engraving falls into one of two broad camps. One is mechanical rotary engraving, in which [...] Read More
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Product designers and process engineers considering laser welding as an alternative to more conventional types of welding, such as MIG/TIG arc welding, will find each has its plusses and minuses. But for many applications laser welding is a cleaner, more precise, and more controlled method of welding and is especially useful when looking to bond small, thin materials such as medical tools, foils, and [...] Read More
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